|
Fourier IV SP607B3-C
The Fourier IV is the latest DIY Heat-Sink design to cool both the latest Intel and AMD micro-processors.
The Fourier IV is an all new processor cooler based on the Waved-Fin design, equipped with 4 Heat-Pipes." said Vincent Chan, Thermal Engineer for Spire.
Also new on this advanced processor cooler are the swift fan exchange clips enabling you to remove the fan quickly and without tools. When utilizing a low power Celeron or Duo-Core micro processor with good system cooling using an active cooler is not mandatory as the Spire Fourier IV heat-sink offers exceptional passive cooling qualities on it's own.
The Fourier IV is an excellent DIY option those for those who are upgrading their system, enthusiast and gamers alike.
Main Features:
- All Copper High-density Wave Heat Sink
- 4 thermally improved copper heat-pipes
- Ball bearing 90mm blue translucent fan
- Silent; Manually controlled PCI Fan Control
- Universal Clip for 775 and K8 sockets
- Passive or active solution; Swift click on/off fan
| Socket 754 / 940 / 775 / 939 Cooling kit |
|
| Dimensions |
| Heat sink : |
126×107×99 mm (l × w × h) |
| 12VDC Fan : |
92×92×25 mm |
|
|
| Bearing |
Ball bearing |
|
| Rated speed |
2000 - 3500 RPM +/-10% |
|
| Rated power |
2.4 - 4.8 W |
|
| Noise level |
19.0 - 26.0 dBA |
|
| Air flow |
36.8 - 58.21 CFM |
|
| Current |
0.20 - 0.40 A |
|
| Life hours |
Ball: 50.000 |
|
| Features |
Universal 775 & K8
4 Thermally Improved Heat-Pipes
All copper Heat-Sink |
|
| Connector |
3 Pin, mainboard |
|
| Application |
| Intel : |
Celeron D ~ 2.93 GHz (340J) |
|
Pentium 4 ~ 3.73 GHz (775 Prescott) |
|
Pentium D ~ 3.4 GHz (775 Dual-Core) |
|
Pentium EE ~ 3.73 GHz (775 Dual-Core) |
| AMD : |
Athlon 64 ~ 4800+ (K8) |
|
Athlon 64 FX-51 (K8) |
|
Athlon 64 FX-53 (K8) |
|
Athlon 64 FX-55 (K8) |
|
Athlon 64 FX-57 (K8) |
|
Athlon 64 FX-60 (K8) |
|
Opteron ~ 2.6 (K8) |
|
Sempron ~ 3300+ (K8) |
|
|
| Thermal resistance |
0.21 °C/W |
|
| Thermal type |
Stars-420 white grease(Injection Tube,0.5g) |
|
|
| *All Spire CPU cooling products come with thermal compound either pre-applied onto the cooler or in an injection tube. Compound will begin to function at its optimum potential, after a gradual increase in heat-dissipation, approximately 168 hours (7days) after initial application. |
|
|
* All technical data shown above are measurements from the Spire laboratory. Product images shown may differ from actual product. Specifications are subject to change without prior notice. |
Cart is empty
