OCZ DDR2 PC2-5400 / 667MHz / Titanium XTC / AM2 Limited Edition / 4GB / 8GB

The new PC2-5400 Titanium modules were designed exclusively for the AMD AM2 platform and are custom-tailored to the extended column address range of the AM2 memory controller. With a doubled page size, access penalties are reduced to ultimately improve system performance. Used on the AM2 platform, the architecture of these modules is particularly beneficial for large CAD model processing and memory intense graphics applications such as filters in Adobe Photoshop or video processing.

With 11 column address bit support by the AM2 memory controller, the number of addresses in each row or page can be as high as 2048 individual entries for a page size of 16kbit. Unlike modules based on standard 10-bit column address chips with an “8k” page size, the new Titanium AM2 Special modules take advantage of the AM2 controller’s feature set and provide a single rank solution with 2GB density using “16k” pages. This allows the controller to stay “in page” twice as long compared to standard memory architectures, thereby achieving unparalleled performance.

The PC2-5400 AM2 Special modules are optimized for 64-bit operating systems. Each module is 100% hand-tested for quality assurance and compatibility and feature high quality, titanium-mirrored XTC (Xtreme Thermal Convection) heatspreaders for the most effective heat dissipation. As part of OCZ’s line-up of premium memory, the AM2 Special series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind

Specifications:

 667MHz DDR2       
 5-5-5-15       
 Available in 4GB (2x2GB) Dual Channel Kits and 8GB (4x2GB) Quad Kits       
 Unbuffered       
 Titanium XTC* Heatspreader       
 OCZ Lifetime Warranty       
 1.8 - 2.0 Volts       
 240 Pin DIMM

Special Features
       
 Designed Exclusively for AMD AM2 Platforms**       
 2.1V EVP***

Part Number:

8GB (4x2GB) Quad Kit PN - OCZ2T667AM8GQ   


* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.

**Not compatible with Intel platforms

***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.1V without invalidating their OCZ Lifetime Warranty.