OCZ DDR2 PC2-6400 / 800MHz / 4x4GB Modules / Vista Upgrade Edition
16GB Memory Kit!
“P45 Special” 4GB modules are exclusively supported by Intel®’s latest chipset. Available in 16GB "quad" kits, this new line of 4GB modules supports the latest memory-hungry applications and games, while offering superior performance headroom. As an industry first, OCZ brings system memory densities to the desktop segment that were reserved previously for high-end server configurations, offering a unique range of high-density kits to suit the varying requirements and budgets of gamers, enthusiasts, and professionals.
The PC2-6400 4GB modules are ideal for enthusiasts, professionals, and DIY system-builders using 64-bit operating systems that can take advantage of high density memory configurations. As the ultimate challenge for hardcore gamers, the latest DirectX-10 games require large amounts of memory to minimize swapfile access and allow smooth game play.
The new PC2-6400 Vista Upgrade series is optimized for perfect compatibility for those transitioning from Microsoft Windows® XP to 64-bit Vista. Furthermore, each OCZ Vista Upgrade module is 100% hand-tested for quality assurance and compatibility and is backed by an industry leading OCZ Lifetime Warranty and technical support for unparalleled peace of mind.
Specifications:
800MHz DDR2
CL 5-6-6-18
(CAS-TRCD-TRP-TRAS)
1.8V
1.85V EVP
Available in 16GB (4x4096MB) "quad" kits*
Unbuffered
Black XTC Heatspreader**
Lifetime Warranty
240 Pin DIMM
Part Number:
16GB (4x4096) D/C Kit PN - OCZ2VU80016GQ
* Currently only P45 and P43 chipsets support 8GB/16GB RAM densities. In order to boot on some motherboards this product is programmed to 667MHz; to run at 800MHz you will need to manually set the speed to 800MHz and voltage to 1.8V in your BIOS.
**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
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