The Reaper HPC is an innovative cooling solution developed by OCZ to effectively minimize heat produced by high-speed memory. As heat rises into the thermo-conductive copper heat pipe conduit, it is dissipated through the strategically-placed compact aluminum fin array. By guiding performance-robbing heat away from key memory components, the unique Reaper HPC design helps facilitate improved overclocking performance, while improving longevity and stability of the modules.

The first modules to be incorporated with the new Reaper heatsink are rated at 1066MHz and run at CL 5-5-5. Featuring an EPP (Enhanced Performance Profiles) programmed SPD, PC2-8500 Reaper HPC modules will immediately boot at the rated specs on the latest generation of NVIDIA® SLI™ chipsets. Although the OCZ Reaper HPC series was coined for enthusiasts, EPP eliminates the need for manual configuration and makes memory optimizations a household item for the complete range of consumers looking to maximize system performance through overclocking.

As part of OCZ’s line-up of premium memory, PC2-8500 modules are backed by a Lifetime Warranty and industry-leading technical support.


* The Reaper HPC series uses heat pipe technology to rapidly remove heat from the main body of the memory modules and conduct the thermal load to the extended radiator fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.

**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.4V ± 5% without invalidating their OCZ Lifetime Warranty.