These DDR3 memory modules are a new memory solution that implements a high-performance specification optimized and predefined for the Intel X38 chipset. Designed to significantly increase performance levels of the entire platform, these modules feature Intel Extreme Memory Profiles (XMP), an exclusive set of SPD (Serial Presence Detect) settings that act as an integrated “plug and play” overclocking tool.

Configured to Intel’s defined specification, the industry’s first XMP-Ready memory will be available as OCZ DDR3 PC3-12800 1GB (1024MB) Modules and 2GB (2x1024MB) dual channel kits, and are configured to run 8-8-8 latencies. Furthermore, each OCZ XMP module also features 7-6-6 latencies on a second profile that is qualified by OCZ for the extreme enthusiast.

Not up to speed on DDR3 technology? Please enjoy these DDR3 FAQs.

* Intel qualified specification


**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.


***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 1.95V without invalidating their OCZ Lifetime Warranty.